Ultrasonic cutting machine - Company Ranking(5 companies in total)
Last Updated： Aggregation Period:Dec 17, 2025〜Jan 13, 2026
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Display Company Information
| Company Name | Featured Products | ||
|---|---|---|---|
| Product Image, Product Name, Price Range | overview | Application/Performance example | |
Ultrasonic cutting device for sample preparation for cross-section and SEM observation.
10 million yen-50 million yen |
【Specifications】 ■Compatible work sizes: φ100mm, 75mm square ■Cutting height: 9mm ■Device dimensions: 640W mm × 900D mm × 1,350H mm (Exclu... | 【Purpose】 - Streamlining the production of cross-sectional samples - Reducing the time from ion milling to SEM observation as a preprocessin... | |
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Ultrasonic cutting device for sample preparation for cross-section and SEM observation.
10 million yen-50 million yen |
【Specifications】 ■Compatible work sizes: φ100mm, 75mm square ■Cutting height: 9mm ■Device dimensions: 640W mm × 900D mm × 1,350H mm (Exclu... | 【Purpose】 - Streamlining the production of cross-sectional samples - Reducing the time from ion milling to SEM observation as a preprocessin... | |
Mass production ultrasonic dicing equipment: Ultrasonic cutting device CSX501
10 million yen-50 million yen |
【Specifications】 ■Compatible work sizes: 6, 8 inches (shared) ■Blade height: Maximum 12mm (cutting limit 10mm) ■Cleaning method: 2-fluid JET... | 【Applications】 - Various wafer dicing (6, 8 inch) - Special processing - Processing of difficult-to-cut materials such as SiC 【Achievements... | |
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日精 本社
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- Featured Products
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Ultrasonic cutting device for sample preparation for cross-section and SEM observation.
- overview
- 【Specifications】 ■Compatible work sizes: φ100mm, 75mm square ■Cutting height: 9mm ■Device dimensions: 640W mm × 900D mm × 1,350H mm (Exclu...
- Application/Performance example
- 【Purpose】 - Streamlining the production of cross-sectional samples - Reducing the time from ion milling to SEM observation as a preprocessin...
Ultrasonic cutting device for sample preparation for cross-section and SEM observation.
- overview
- 【Specifications】 ■Compatible work sizes: φ100mm, 75mm square ■Cutting height: 9mm ■Device dimensions: 640W mm × 900D mm × 1,350H mm (Exclu...
- Application/Performance example
- 【Purpose】 - Streamlining the production of cross-sectional samples - Reducing the time from ion milling to SEM observation as a preprocessin...
Mass production ultrasonic dicing equipment: Ultrasonic cutting device CSX501
- overview
- 【Specifications】 ■Compatible work sizes: 6, 8 inches (shared) ■Blade height: Maximum 12mm (cutting limit 10mm) ■Cleaning method: 2-fluid JET...
- Application/Performance example
- 【Applications】 - Various wafer dicing (6, 8 inch) - Special processing - Processing of difficult-to-cut materials such as SiC 【Achievements...
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日精 本社
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